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  ha17324/a series quad operational amplifier ade-204-031 (z) 1st edition apr. 2000 description ha17324 series and ha17324a series are quad operational amplifier that provide high gain and internal phase compensation, with single power supply. they can be widely used to control equipments. features wide range of supply voltage, and single power supply used internal phase compensation wide range of common mode voltage, and possible to operate with an input about 0v features only for ??series low electro-magnetic interference level output offset voltage vs. input interference measurement condition output offset voltage (arb. unit) 5.0 4.0 3.0 2.0 1.0 0 - 1.0 100e+3 1e+6 10e+6 100e+6 1e+9 10e+9 input rf frequency (hz) ha17324a series ha17324 series rs - + rs 0.01 m vin - 10 dbm rf signal source (for quasi-rf noise) vcc = +7.5 v vee = - 7.5 v rf rf vout (= 100 * vio) v _ notice: the example of an applied circuit or combination with other equipment shown herein indicates characteristics and performance of semiconductor -applied products. the company shall assume no responsibility for any problem involving a patent caused when applying the descriptions in the example.
ha17324/a series 2 ordering information ha17324 series type no. application package ha17324p industrial use dp-14 ha17324fp fp-14da ha17324 commercial use dp-14 ha17324f fp-14da ha17324a series type no. application package ha17324ap industrial use dp-14 ha17324arp fp-14dn ha17324afp fp-14da
ha17324/a series 3 pin arrangement vout1 vin( - )1 vin(+)1 v cc vin(+)2 vin( - )2 vout2 vout4 vin( - )4 vin(+)4 v ee vin(+)3 vin( - )3 vout3 - 1 + 2 (top view) 1 3 2 3 4 5 6 7 14 13 12 11 10 9 8 + 4 - - + + - circuit schematic (1/4) q 1 q 4 q 2 q 3 q 5 q 6 q 7 q 13 q 12 q 11 q 10 q 8 q 9 vout r 1 vin(+) vin( - ) c
ha17324/a series 4 absolute maximum ratings (ta = 25 c) ratings item symbol ha17324/p/ap ha17324f/fp/arp/afp unit supply voltage v cc 32 32 v sink current isink 50 50 ma power dissipation p t 625 * 1 625 * 2 mw common mode input voltage v cm ?.3 to v cc ?.3 to v cc v differential input voltage vin (diff) v cc v cc v operating temperature topr ?0 to +75 ?0 to +75 c storage temperature tstg ?5 to +125 ?5 to +125 c notes: 1. this is the allowable values up to ta = 50 c. derate by 8.3 mw/ c. 2. tjmax = q j-a ?p c max + ta ( q j-a; thermal resistor between junction and ambient at set board use). the wiring density and the material of the set board must be chosen for thermal conductance of efficacy board. and p c max cannot be over the value of p t . 240 220 200 180 160 140 120 100 80 thermal resistor q j-a ( c) 0.5 1 2 5 10 20 thermal conductance of efficacy board (w/m c) ab sop14 - with compound sop14 - no compound 40 mm a. class epoxy board of 10% wiring density b. class epoxy board of 30% wiring density 1.5 t epoxy
ha17324/a series 5 electrical characteristics (v cc = +15 v, ta = 25 c) item symbol min typ max unit test conditions input offset voltage v io 27mvv cm = 7.5 v, r s = 50 w , rf = 50 k w input offset current i io 5 50 na v cm = 7.5 v, i io = | i i (? ?i i (+) | input bias current i ib 30 500 na v cm = 7.5 v power source rejection ratio psrr 93 db f = 100 hz, r s = 1 k w , rj = 100 k w voltage gain a vd 75 90 db r s = 1 k w , rf = 100 k w , r l = common mode rejection ratio cmr 80 db r s = 50 w , rf = 5 k w common mode input voltage range v cm ?.3 13.5 v r s = 1 k w , rf = 100 k w , f = 100 hz maximum output voltage vop-p 13.6 v f = 100 hz, r s = 1 k w , rf = 100 k w , r l = 20 k w output source current iosource 20 40 ma v in + = 1 v, v in = 0 v, v oh = 10 v output sink current iosink 10 20 ma v in = 0 v, v in = 1 v, v ol = 2.5 v supply current i cc 0.8 2 ma v in = gnd, r l = slew rate sr 0.19 v/ m s f = 1.5 khz, v cm = 7.5 v, r l = channel separation cs 120 db f = 1 khz output sink current iosink 15 50 m av in + = 0 v, v in = 1 v, v ol = 200 mv iosink 3 9 ma v in + = 0 v, v in = 1 v, v ol = 1 v output voltage v oh 13.2 13.6 v i oh = ? ma v oh 12.0 13.3 v i oh = ?0 ma output voltage v ol 0.8 1.0 v i ol = 1 ma v ol 1.1 1.8 v i ol = 10 ma
ha17324/a series 6 characteristic curves output source current vs. ambient temperature 80 output source current iosource (ma) ambeint temperature ta ( c) 70 60 50 40 30 20 10 0 - 200 20406080 v cc = 15 v v oh = 10 v input bias current vs. ambient temperature 80 input bias current i ib (na) ambeint temperature ta ( c) 70 60 50 40 30 20 10 0 - 200 20406080 v cc = 15 v v cm = 7.5 v supply current vs. supply voltage 4 supply current i cc (ma) supply voltage v cc (v) 3 2 1 0 8 16243240 ta = 25 c 80 input bias current i ib (na) supply voltage v cc (v) 60 40 20 0 8 16243240 ta = 25 c voltage gain vs. supply voltage 160 voltage gain a vd (db) supply voltage v cc (v) 120 80 40 0 8 16243240 ta = 25 c r l = maxlmum output voltage vs. frequency input bias current vs. supply voltage 20 maximum output voltage v op - p (v) frequency f (hz) 1 k 3 k 10 k 30 k 100 k 300 k 16 12 8 4 0 v cc = 15 v ta = 25 c r l = 20 k w 1 m
ha17324/a series 7 voltage gain vs. frequency v cc = 15v ta = 25 c r l = voltage gain a vd (db) 120 100 80 60 40 20 0 1 3 10 30 100 300 1 k 3 k 10 k 30 k 100 k 300 k 1 m frequency f (hz) v cc = 15v ta = 25 c r s = 50 w 120 100 80 60 40 20 0 100 300 1 k 3 k 10 k 30 k 100 k 300 k 1m frequency f (hz) common mode rejection ratio vs. frequency common mode rejection ratio cmr (db)
ha17324/a series 8 solder mounting method 1. small and light surface-mount packages require spicial attentions on solder mounting. on solder mounting, pre-heating before soldering is needed. the following figure show an example of infrared rays refow. 2. the difference of thermal expansion coefficeient between mounted substrates and ic leads may cause a failure like solder peeling or soler wet, and electrical characteristics may change by thermal stress. therefore, mounting should be done after sufficient confirmation for especially in case of ceramic substrates. temperature 140 to 160 c 1 to 5 c/s 235 c max 10 s max 1 to 4 c/s time (s) @ 60 s figure 1 an example of infrared rays reflow conditions
ha17324/a series 9 package dimensions hitachi code jedec eiaj mass (reference value) dp-14 conforms conforms 0.97 g unit: mm 7.62 0.25 0 ?15 19.20 20.32 max 1 8 14 7 1.30 2.54 0.25 0.48 0.10 6.30 7.40 max 0.51 min 2.54 min 5.06 max + 0.10 ?0.05 2.39 max hitachi code jedec eiaj mass (reference value) fp-14da conforms 0.23 g unit: mm *dimension including the plating thickness base material dimension *0.22 0.05 *0.42 0.08 0.70 0.20 0.12 0.15 0 ?8 m 0.10 0.10 2.20 max 5.5 10.06 1.42 max 14 8 1 7 10.5 max + 0.20 ?0.30 7.80 1.15 1.27 0.40 0.06 0.20 0.04
ha17324/a series 10 hitachi code jedec eiaj weight (reference value) fp-14dn conforms conforms 0.13 g unit: mm 0 ?8 1.27 14 8 1 7 0.15 0.25 m 1.75 max 3.95 *0.20 0.05 8.65 9.05 max *0.40 0.06 0.14 + 0.11 ?0.04 0.635 max 6.10 + 0.10 ?0.30 0.60 + 0.67 ?0.20 1.08 *pd plating
ha17324/a series 11 cautions 1. hitachi neither warrants nor grants licenses of any rights of hitachi? or any third party? patent, copyright, trademark, or other intellectual property rights for information contained in this document. hitachi bears no responsibility for problems that may arise with third party? rights, including intellectual property rights, in connection with use of the information contained in this document. 2. products and product specifications may be subject to change without notice. confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. hitachi makes every attempt to ensure that its products are of high quality and reliability. however, contact hitachi? sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. design your application so that the product is used within the ranges guaranteed by hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail- safes, so that the equipment incorporating hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the hitachi product. 5. this product is not designed to be radiation resistant. 6. no one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from hitachi. 7. contact hitachi? sales office for any questions regarding this document or hitachi semiconductor products. hitachi, ltd. semiconductor & integrated circuits. nippon bldg., 2-6-2, ohte-machi, chiyoda-ku, tokyo 100-0004, japan tel: tokyo (03) 3270-2111 fax: (03) 3270-5109 copyright ? hitachi, ltd., 2000. all rights reserved. printed in japan. hitachi asia pte. ltd. 16 collyer quay #20-00 hitachi tower singapore 049318 tel: 535-2100 fax: 535-1533 url northamerica : http:semiconductor.hitachi.com/ europe : http://www.hitachi-eu.com/hel/ecg asia (singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm asia (taiwan) : http://www.hitachi.com.tw/e/product/sicd_frame.htm asia (hongkong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm japan : http://www.hitachi.co.jp/sicd/indx.htm hitachi asia ltd. taipei branch office 3f, hung kuo building. no.167, tun-hwa north road, taipei (105) tel: <886> (2) 2718-3666 fax: <886> (2) 2718-8180 hitachi asia (hong kong) ltd. group iii (electronic components) 7/f., north tower, world finance centre, harbour city, canton road, tsim sha tsui, kowloon, hong kong tel: <852> (2) 735 9218 fax: <852> (2) 730 0281 telex: 40815 hitec hx hitachi europe ltd. electronic components group. whitebrook park lower cookham road maidenhead berkshire sl6 8ya, united kingdom tel: <44> (1628) 585000 fax: <44> (1628) 778322 hitachi europe gmbh electronic components group dornacher stra b e 3 d-85622 feldkirchen, munich germany tel: <49> (89) 9 9180-0 fax: <49> (89) 9 29 30 00 hitachi semiconductor (america) inc. 179 east tasman drive, san jose,ca 95134 tel: <1> (408) 433-1990 fax: <1>(408) 433-0223 for further information write to:


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